HMG493-SB1: Difference between revisions

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[[File:HMG493-SB1.png|center|frameless|726x726px|HMG493-SB1]]
[[File:HMG493-SB1.png|center|frameless|726x726px|HMG493-SB1]]


==Application[edit | edit source]==
==Application==
*Artificial intelligence
*Artificial intelligence
*Heavy scientific computation
*Heavy scientific computation
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*Research lab/national lab
*Research lab/national lab
*Astrophysics, business intelligence
*Astrophysics, business intelligence
==Features[edit | edit source]==
==Features==
#2 Intel Gen 4<sup>th</sup> Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage
#2 x Intel Gen 4<sup>th</sup> or 5<sup>th</sup> Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage
# 4U formfactor, 10 double-width full-height GPUs over [[PCIe]] 5.0, Dual ROM Architecture
# 4U formfactor, 10 double-width full-height GPUs over [[PCIe]] 5.0, Dual ROM Architecture
# Dual processor, LGA 4677, Intel<sup>®</sup> 4th Gen Xeon<sup>®</sup> Scalable and Intel<sup>®</sup> Xeon<sup>®</sup> CPU Max Series Processors (CPU TDP up to 350W)
# Dual processor, LGA 4677, Intel<sup>®</sup> 4th Gen Xeon<sup>®</sup> Scalable and Intel<sup>®</sup> Xeon<sup>®</sup> CPU Max Series Processors (CPU TDP up to 350W)
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# 3+1 3000W 80 PLUS Titanium redundant power
# 3+1 3000W 80 PLUS Titanium redundant power
# Suitable for various application scenarios, including big data analysis, 3D graphics applications, video decoding, deep learning, scientific computing, and more
# Suitable for various application scenarios, including big data analysis, 3D graphics applications, video decoding, deep learning, scientific computing, and more
==Specifications[edit | edit source]==
==Specifications==
{| class="wikitable"
{| class="wikitable"
|'''Type'''
|'''Type'''
| colspan="2" |'''Description'''
|'''Description'''
|-
|-
|'''Processor'''
|'''Processor'''
|4th Generation Intel<sup>®</sup> Xeon<sup>®</sup> Scalable Processors, Intel<sup>®</sup> Xeon<sup>®</sup> CPU Max Series, Intel<sup>®</sup> Xeon<sup>®</sup> Platinum Processor, Intel<sup>®</sup> Xeon<sup>®</sup> Gold Processor, Intel<sup>®</sup> Xeon<sup>®</sup> Silver Processor, Dual processor, CPU TDP up to 350W
|4th Gen Intel<sup>®</sup> Xeon<sup>®</sup> Scalable Processors,
|Same except unlimited TDP with [[CoolUX]]
5th Gen Intel<sup>®</sup> Xeon<sup>®</sup> Scalable Processors
, Intel<sup>®</sup> Xeon<sup>®</sup> CPU Max Series,  
 
Dual processor, CPU TDP up to 350W
'''Optional [[liquid cooling]] with [[CoolUX]] that support unlimited CPU TDP'''
|-
|-
|'''Memory'''
|'''Memory'''
| colspan="2" |32 x DIMM slots
|32 x DIMM slots
DDR5 memory supported only
DDR5 memory supported only


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|-
|-
|'''Storage'''
|'''Storage'''
| colspan="2" |SATA RAID 0/1/10/5
|SATA RAID 0/1/10/5
|-
|-
|Drive Bays
|Drive Bays
| colspan="2" |12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS*hot-swappable bays (optional '''SAS card for SAS devices)'''
|12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS*hot-swappable bays (optional '''SAS card for SAS devices)'''
1 x M.2 slot with PCIe Gen3 x1 interface onboard
1 x M.2 slot with PCIe Gen3 x1 interface onboard
|-
|-
| rowspan="2" |Cooling
| rowspan="2" |Cooling
|Air cooling
|Air cooling  
|[[Liquid cooling]]                                                                                                                                                                                                                                                                                                                                                                                                               
4 x 40x40x28mm (25,000rpm)
12 x 60x60x38mm (23,000rpm)
|-
|-
|6 x 60x60x38mm (23,000rpm)
|'''Optional liquid cooling with [[CoolUX]] : No screaming Fan noise Max. < 50dbA'''
|Yes, [[CoolUX]]
|-
|-
|'''Expansion Slots'''
|'''Expansion Slots'''
|10 x FHFL PCIe Gen5 x16 slots for double-width GPUs  
|10 x FHFL PCIe Gen5 x16 slots for double-width GPUs  
2 x LP PCIe Gen5 x16 slots on front side  
2 x LP PCIe Gen5 x16 slots on front side ( '''Optional liquid cooling with [[CoolUX]]  uses this area for coolant in/out''' )
|8 x FHFL PCIe Gen5 x16 slots for double-width GPUs
2 x LP PCIe Gen5 x16 slots on front side
|-
|-
|'''Network'''
|'''Network'''
| colspan="2" |2 x 10Gb/s BASE-T LAN ports (NCSI function supported)
|2 x 10Gb/s BASE-T LAN ports (NCSI function supported)
1 x 10/100/1000 IBMI management LAN (Dual ROM architecture – remove firmware update, management and monitoring)
1 x 10/100/1000 IBMI management LAN (Dual ROM architecture – remove firmware update, management and monitoring)
|-
|-
|Chipset
|Chipset
| colspan="2" |Intel<sup>®</sup> C741 Chipset
|Intel<sup>®</sup> C741 Chipset
|-
|-
|'''Switch/LED'''
|'''Switch/LED'''
| colspan="2" |'''Front :'''
|'''Front :'''
2 x USB 3.2 Gen1
2 x USB 3.2 Gen1


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|'''Rear I/O Ports'''
|'''Rear I/O Ports'''
|N/A
|N/A
|Coolant In and Out
|-
|-
|'''OS [[Support]]'''
|'''OS [[Support]]'''
| colspan="2" |[[Linux]] Ubuntu 20.04 LTS
|[[Linux]] Ubuntu 20.04 LTS with kernel level [[optimization]]
|-
|-
|'''Software'''
|'''Software'''
| colspan="2" |HPCMATE DLS Framework
|HPCMATE DLS Framework
|-
|-
|'''Power Supply'''
|'''Power Supply'''
| colspan="2" |3+1 3000W (240V) 80 PLUS Titanium redundant power supplies
|3+1 3000W (240V) 80 PLUS Titanium redundant power supplies
|-
|-
|'''Dimension/Net Weight'''
|'''Dimension/Net Weight'''
| colspan="2" |448 x 176 x 880(WxHxD, mm)
|448 x 176 x 880(WxHxD, mm)
1200 x 800 x 444 mm w/ pallet
1200 x 800 x 444 mm w/ pallet
|-
|-
|'''Environment'''
|'''Environment'''
| colspan="2" |Operating temperature: 10°C to 35°C
|Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Operating humidity: 8%-80% (non-condensing)


Latest revision as of 12:48, 12 January 2024

HMG493-SB1

Application

  • Artificial intelligence
  • Heavy scientific computation
  • High-performance computing
  • Research lab/national lab
  • Astrophysics, business intelligence

Features

  1. 2 x Intel Gen 4th or 5th Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage
  2. 4U formfactor, 10 double-width full-height GPUs over PCIe 5.0, Dual ROM Architecture
  3. Dual processor, LGA 4677, Intel® 4th Gen Xeon® Scalable and Intel® Xeon® CPU Max Series Processors (CPU TDP up to 350W)
  4. 32 x DIMMs slots, 8-Channel RDIMM DDR5
  5. 2 x 10Gb/s BASE-T LAN ports and 1 x Dedicated management port
  6. 1 x M.2 slot with PCIe Gen3 x1 interface / 12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS* hot-swap bays
  7. 10 x FHFL PCIe Gen5 x16 slots for double-width GPUs / 2 x LP PCIe Gen5 x16 slots on front side
  8. 3+1 3000W 80 PLUS Titanium redundant power
  9. Suitable for various application scenarios, including big data analysis, 3D graphics applications, video decoding, deep learning, scientific computing, and more

Specifications

Type Description
Processor 4th Gen Intel® Xeon® Scalable Processors,

5th Gen Intel® Xeon® Scalable Processors , Intel® Xeon® CPU Max Series,

Dual processor, CPU TDP up to 350W Optional liquid cooling with CoolUX that support unlimited CPU TDP

Memory 32 x DIMM slots

DDR5 memory supported only

8-Channel memory architecture per processor

RDIMM modules up to 96GB supported

3DS RDIMM modules up to 256GB supported

Memory speed: Up to 4800 MHz (1DPC), 4400 MHz (2DPC)

Storage SATA RAID 0/1/10/5
Drive Bays 12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS*hot-swappable bays (optional SAS card for SAS devices)

1 x M.2 slot with PCIe Gen3 x1 interface onboard

Cooling Air cooling

4 x 40x40x28mm (25,000rpm) 12 x 60x60x38mm (23,000rpm)

Optional liquid cooling with CoolUX  : No screaming Fan noise Max. < 50dbA
Expansion Slots 10 x FHFL PCIe Gen5 x16 slots for double-width GPUs

2 x LP PCIe Gen5 x16 slots on front side ( Optional liquid cooling with CoolUX uses this area for coolant in/out )

Network 2 x 10Gb/s BASE-T LAN ports (NCSI function supported)

1 x 10/100/1000 IBMI management LAN (Dual ROM architecture – remove firmware update, management and monitoring)

Chipset Intel® C741 Chipset
Switch/LED Front :

2 x USB 3.2 Gen1

1 x VGA

2 x RJ45

1 x MLAN

1 x Power button with LED

1 x ID button with LED

1 x Reset button

1 x NMI button

1 x System status LED

1 x HDD access LED

Rear I/O Ports N/A
OS Support Linux Ubuntu 20.04 LTS with kernel level optimization
Software HPCMATE DLS Framework
Power Supply 3+1 3000W (240V) 80 PLUS Titanium redundant power supplies
Dimension/Net Weight 448 x 176 x 880(WxHxD, mm)

1200 x 800 x 444 mm w/ pallet

Environment Operating temperature: 10°C to 35°C

Operating humidity: 8%-80% (non-condensing)

Non-operating temperature: -40°C to 60°C

Non-operating humidity: 20%-95% (non-condensing)

Category

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