HMDLS-D8: Difference between revisions

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[[File:Hmdls-d8.png|center|frameless|191x191px|HMDLS-D8]]
==Application==
==Application==
*Artificial intelligence
*Artificial intelligence
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*Astrophysics, business intelligence
*Astrophysics, business intelligence
==Features==
==Features==
#Dual chamber, high air flow
#Dual chamber, High Air Flow GPGPU workstation
#Quite and adjustable Max. noise level
#Quite and adjustable Max. noise level
#Space optimized workstation with 2000W PSU
#Space optimized workstation with 2000W PSU
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==Specifications==
==Specifications==
{| class="wikitable"
{| class="wikitable"
| colspan="2" |'''System'''
|-
|-
| rowspan="3" |'''System'''
|Form Factor
|Form Factor
|Workstation
|Workstation
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|HMD8-2T-BCM
|HMD8-2T-BCM
|-
|-
| colspan="2" |'''Cooling / UCM features'''
| rowspan="2" |'''Cooling'''  
|-
|[http://192.168.1.204/index.php/Liquid_cooling Liquid Cooling]
|[http://192.168.1.204/index.php/Liquid_cooling Liquid Cooling]
|No
|No
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|Air Cooling
|Air Cooling
|Yes (Default)
|Yes (Default)
5 x PWM 120x120 mm, 1 x PWM 140x140mm, 2 x 50x50  
5 x PWM 120x120 mm, 1 x PWM 140x140mm, 2 x 50x50
|-
|-
|'''UCM'''
|UCM Readyness
|UCM Readyness
|Optional
|Optional
|-
|-
| colspan="2" |'''Front Panel'''
| rowspan="2" |'''Front Panel'''
|-
|Buttons
|Buttons
|Power w/ LED
|Power w/ LED
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|HDD Activity
|HDD Activity
|-
|-
|I/O Ports
| rowspan="3" |'''Storage'''
|
|-
| colspan="2" |'''Drive Bay / Storage'''
|-
|Rear Side
|Rear Side
| -
| -
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|3 x 3.5" SAS/SATA Hotswap drive bay
|3 x 3.5" SAS/SATA Hotswap drive bay
|-
|-
| colspan="2" |'''Power Supply'''
| rowspan="3" |'''Power'''
|-
|Type
|1
|-
|Output Watts
|Output Watts
|2000W
|2000W
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|Low-line: 100-127V, 47-63Hz ; High-line: 200-240V, 47-63Hz
|Low-line: 100-127V, 47-63Hz ; High-line: 200-240V, 47-63Hz
|-
|-
| colspan="2" |'''Processor System'''
| rowspan="3" |'''Processor'''
|-
|CPU
|CPU
|Supports AMD EPYC™ 7002/7003 (with AMD 3D V-Cache™ Technology*) Series Processors
|Supports AMD EPYC™ 7002/7003 (with AMD 3D V-Cache™ Technology*) Series Processors
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|System on Chip
|System on Chip
|-
|-
| colspan="2" |'''System Memory'''
| rowspan="5" |'''Memory'''
|-
|DIMM Quantity
|Supported DIMM Quantity
|8 DIMM slots (1DPC)
|8 DIMM slots (1DPC)
|-
|-
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|RDIMM: up to 64GB
|RDIMM: up to 64GB
LRDIMM: up to 128GB
LRDIMM: up to 128GB
RDIMM/LRDIMM-3DS: up to 256GB
RDIMM/LRDIMM-3DS: up to 256GB
NVDIMM-N: up to 32GB
NVDIMM-N: up to 32GB
|-
|-
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|1.2V
|1.2V
|-
|-
| rowspan="2" |I/O
| colspan="2" |'''[http://192.168.1.204/index.php/PCIe PCIe] Expansion Slots (SLOT7 close to CPU)'''
| colspan="2" |'''[http://192.168.1.204/index.php/PCIe PCIe] Expansion Slots (SLOT7 close to CPU)'''
|-
|-
|[[PCIe]] x 16
|[[PCIe]] x 16
|SLOT7: PCIe4.0 x16
|SLOT7: PCIe4.0 x16<br/>SLOT6: PCIe4.0 x16<br/>SLOT5: PCIe4.0 x16<br/>SLOT4: PCIe4.0 x16<br/>SLOT3: PCIe4.0 x16<br/>SLOT2: PCIe4.0 x16 or PCIe4.0 x8 + 1 M.2+1 miniSASHD or no PCIe SLOT +2 OCuLink+1 M.2+1 miniSAS HD (by jumper)<br/>SLOT1: PCIe4.0 x16
SLOT6: PCIe4.0 x16
 
SLOT5: PCIe4.0 x16
 
SLOT4: PCIe4.0 x16
 
SLOT3: PCIe4.0 x16
 
SLOT2: PCIe4.0 x16 or PCIe4.0 x8 + 1 M.2+1 miniSASHD or no PCIe SLOT +2 OCuLink+1 M.2+1 miniSAS HD (by jumper)
 
SLOT1: PCIe4.0 x16
|-
|-
| colspan="2" |'''Ethernet'''
| rowspan="9" |Rear IO
|-
|GbE Controller
|Additional GbE Controller
|1 Broadcom BCM57416 2 RJ45 (10GbE)
|1 Broadcom BCM57416 2 RJ45 (10GbE)
|-
|-
| colspan="2" |'''Server Management'''
|RJ45
|2 RJ45 (10GbE)
1 dedicated IPMI
|-
|-
|BMC Controller
|BMC Controller
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|IPMI Dedicated GLAN
|IPMI Dedicated GLAN
|1 x Realtek RTL8211E for dedicated management GLAN
|1 x Realtek RTL8211E for dedicated management GLAN
|-
| colspan="2" |'''Graphics'''
|-
|-
|Controller
|Controller
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|VRAM
|VRAM
|DDR4 512MB
|DDR4 512MB
|-
| colspan="2" |'''Rear I/O'''
|-
|UID Button/LED
|1 UID button w/ LED
|-
|-
|VGA Port
|VGA Port
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|2 Type-A (USB3.2 Gen1)
|2 Type-A (USB3.2 Gen1)
|-
|-
|RJ45
| rowspan="2" |BIOS
|2 RJ45 (10GbE)
1 dedicated IPMI
|-
| colspan="2" |'''System [http://192.168.1.204/index.php/BIOS BIOS]'''
|-
|BIOS Type
|BIOS Type
|32MB AMI UEFI Legal BIOS
|32MB AMI UEFI Legal BIOS
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|Plug and Play (PnP), ACPI 6.3 Compliance Wake Up Events, SMBIOS 3.3.0, ASRock Rack Instant Flash
|Plug and Play (PnP), ACPI 6.3 Compliance Wake Up Events, SMBIOS 3.3.0, ASRock Rack Instant Flash
|-
|-
| colspan="2" |'''Hardware Monitor'''
| rowspan="2" |'''Environment'''
|-
|Temperature
|CPU, DRAM, MB, Card Side, Chipset Temperature Sensing
|-
|Fan
|CPU/Rear/Front Fan Tachometer
CPU Quiet Fan (Allow CPU Fan Speed Auto-Adjust by CPU Temperature) CPU/Rear/Front Fan Multi-Speed Control
|-
|Voltage
|Vsoc,Vcpu, VCCM, VPPM, 3V/5V/12V, +BAT, 3VSB, 5VSB
|-
| colspan="2" |'''Environment'''
|-
|Temperature
|Temperature
|Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
|Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C

Latest revision as of 09:24, 10 April 2023

HMDLS-D8

Application

  • Artificial intelligence
  • Big data analytics
  • High-performance computing
  • Research lab/national lab
  • Astrophysics, business intelligence

Features

  1. Dual chamber, High Air Flow GPGPU workstation
  2. Quite and adjustable Max. noise level
  3. Space optimized workstation with 2000W PSU
  4. Single Socket SP3 (LGA 4094), supports AMD EPYC™ 7002/7003 (with AMD 3D V-Cache™ Technology*) series processors
  5. 8 DIMM slots (1DPC), supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
  6. 7 PCIe4.0 x16, 2 OCuLink (PCIe4.0 x4), Supports 2 M.2 (PCIe4.0 x4 or SATA 6Gb/s)
  7. 2 RJ45 (10GbE) by Broadcom BCM57416
  8. Remote Management (IPMI)
  9. 3 x 3.5" Hotswap Drivebay, 4x2.5"/2 x M.2 Internal Drive

Specifications

System Form Factor Workstation
Dimensions 457 x 331 x 407mm (WxHxD)
Support MB HMD8-2T-BCM
Cooling Liquid Cooling No
Air Cooling Yes (Default)

5 x PWM 120x120 mm, 1 x PWM 140x140mm, 2 x 50x50

UCM UCM Readyness Optional
Front Panel Buttons Power w/ LED
LEDs HDD Activity
Storage Rear Side -
Internal Side 2 M-key (PCIe4.0 x4), 4 x 2.5" SAS/SATA fixed drive bay
Front 3 x 3.5" SAS/SATA Hotswap drive bay
Power Output Watts 2000W
Efficiency 80-PLUS Platinum
AC Input Low-line: 100-127V, 47-63Hz ; High-line: 200-240V, 47-63Hz
Processor CPU Supports AMD EPYC™ 7002/7003 (with AMD 3D V-Cache™ Technology*) Series Processors

*A BIOS update is required to support AMD EPYC™ 7003 series processors with AMD 3D V-Cache™ Technology

Socket Single Socket SP3 (LGA4094)
Chipset System on Chip
Memory DIMM Quantity 8 DIMM slots (1DPC)
Supported Type Supports DDR4 288-pin RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
Max. Capacity per DIMM RDIMM: up to 64GB

LRDIMM: up to 128GB RDIMM/LRDIMM-3DS: up to 256GB NVDIMM-N: up to 32GB

Max. DIMM Frequency RDIMM/ LRDIMM/NVDIMM-N: max. 3200MHz
Voltage 1.2V
I/O PCIe Expansion Slots (SLOT7 close to CPU)
PCIe x 16 SLOT7: PCIe4.0 x16
SLOT6: PCIe4.0 x16
SLOT5: PCIe4.0 x16
SLOT4: PCIe4.0 x16
SLOT3: PCIe4.0 x16
SLOT2: PCIe4.0 x16 or PCIe4.0 x8 + 1 M.2+1 miniSASHD or no PCIe SLOT +2 OCuLink+1 M.2+1 miniSAS HD (by jumper)
SLOT1: PCIe4.0 x16
Rear IO GbE Controller 1 Broadcom BCM57416 2 RJ45 (10GbE)
RJ45 2 RJ45 (10GbE)

1 dedicated IPMI

BMC Controller ASPEED AST2500
IPMI Dedicated GLAN 1 x Realtek RTL8211E for dedicated management GLAN
Controller ASPEED AST2500
VRAM DDR4 512MB
VGA Port 1 DB15 (VGA)
Serial Port 1 DB9 (COM)
USB 3.2 Gen1 Port 2 Type-A (USB3.2 Gen1)
BIOS BIOS Type 32MB AMI UEFI Legal BIOS
BIOS Features Plug and Play (PnP), ACPI 6.3 Compliance Wake Up Events, SMBIOS 3.3.0, ASRock Rack Instant Flash
Environment Temperature Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
Humidity Non operation humidity: 20% ~ 90% ( Non condensing)
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