HMDLS-CUBE: Difference between revisions

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{{Status
|status=Draft
|owner=Knowledge Agent
|last_update=2026-07-16
|review=Pending
}}
{{TOC}}
== Overview ==
HMDLS-CUBE에 대한 기술 문서입니다.
=== Summary ===
* 무엇인가? - HMDLS-CUBE
* 왜 필요한가? - HPC 및 서버 환경에서 필수 개념
* 언제 사용하는가? - 서버 구성, 성능 튜닝, 문제 해결 시
---
== Purpose ==
이 문서가 존재하는 이유
* Goal: HMDLS-CUBE에 대한 기술 정보 제공
* Scope: HMDLS-CUBE의 개념, 사용법, 설정
* Non-goals: 다른 주제로의 확장
---
== Key Concepts ==
{| class="wikitable"
! Concept
! Description
! Related
|-
| HMDLS-CUBE
| HPC/서버 환경에서 중요한 기술 개념
| [[Linux]], [[Server]]
|}
---
== Detailed Explanation ==
[[File:Hmdls-cube.png|center|frameless|299x299px|HMDLS-CUBE]]
[[File:Hmdls-cube.png|center|frameless|299x299px|HMDLS-CUBE]]
==Application==
*Artificial intelligence
*Artificial intelligence
*Heavy scientific computation
*Heavy scientific computation
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*Astrophysics, business intelligence
*Astrophysics, business intelligence
*[http://www.hpcmate.com/system/hpcmate&hmdls-cube&new DLS-CUBE @ homepage]
*[http://www.hpcmate.com/system/hpcmate&hmdls-cube&new DLS-CUBE @ homepage]
== Features ==
#Physics dynamic optimized [[liquid cooling]] design
#Physics dynamic optimized [[liquid cooling]] design
##Unlimited CPU and GPU TDP
##Unlimited CPU and GPU TDP
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#Single Socket AMD EPYC™ 7002/7003/9004 (with AMD 3D V-Cache™ Technology*) series processors
#Single Socket AMD EPYC™ 7002/7003/9004 (with AMD 3D V-Cache™ Technology*) series processors
#8 DIMM slots , supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
#8 DIMM slots , supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
#2 10GbE, Dedicated IPMI RJ45
#2 10GbE, Dedicated [[IPMI]] RJ45
#1x2.5", 3 x 3.5" internal drivebay, 2 x M.2 Internal Drive
#1x2.5", 3 x 3.5" internal drivebay, 2 x M.2 Internal Drive
==Specifications==
{| class="wikitable"
{| class="wikitable"
|-
|-
| rowspan="3" |'''System'''
|Model
|Default configuration
|Optional Configuration
|-
|Dimensions
| colspan="2" |394 x 515 x 662 (W x H x D) mm / 35Kg
|-
|[http://192.168.1.204/index.php/Support Support] MB
|HMD8-2T-BMC
|HMGD8-2T-BMC
|-
| rowspan="2" |'''Cooling'''
|[http://192.168.1.204/index.php/Liquid_cooling Liquid Cooling]
| colspan="2" |Yes (Default)
|-
|Air Cooling
| colspan="2" |Yes (Option)
8 x PWM 120x120 mm, 3 x PWM 140x140mm


<nowiki>*</nowiki>Air cooling limites: Max. 4 GPUs, up to 300W TDP CPU
---
|-
|'''UCM'''
|UCM Readyness
| colspan="2" |Optional
|-
| rowspan="2" |'''Front Panel'''
|Buttons
| colspan="2" |Power w/ LED, Reset
|-
|LEDs
| colspan="2" |HDD Activity
|-
| rowspan="3" |'''Storage'''
|Rear Side
| colspan="2" | -
|-
|Internal Side
| colspan="2" |2 M-key (PCIe4.0 x4), 1 x 2.5" SAS/SATA internal, 3 x 3.5" SATA internal drive bay
|-
|Front
| -
|
|-
| rowspan="3" |'''Power'''
|Output Watts
|3000W SPC
|4000W SPC
|-
|Efficiency
| colspan="2" |80-PLUS Platinum
|-
|AC Input
| colspan="2" |Low-line: 100-127V, 47-63Hz ; High-line: 200-240V, 47-63Hz
|-
| rowspan="3" |'''Processor'''
|CPU
|Supports AMD EPYC™ 7002/7003 Series Processors
<nowiki>*</nowiki>A [[BIOS]] update is required to [[support]] AMD EPYC™ 7003 series processors with AMD 3D V-Cache™ Technology
|Supports AMD EPYC™ 9004 Series Processors
|-
|Socket
|Single Socket SP3 (LGA4094)
|Single Socket SP5 (LGA 6096)
|-
|Chipset
| colspan="2" |System on Chip
|-
| rowspan="5" |'''Memory'''
|DIMM Quantity
| colspan="2" |8 DIMM slots (1DPC)
|-
|Supported Type
| colspan="2" |Supports DDR4 288-pin RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
|-
|Max. Capacity per DIMM
|RDIMM: up to 64GB
LRDIMM: up to 128GB


RDIMM/LRDIMM-3DS: up to 256GB
== Best Practices ==


NVDIMM-N: up to 32GB
* 최신 버전 사용 권장
|Supports DDR5 288-pin RDIMM, RDIMM-3DS
* 공식 문서 참고
RDIMM: 64GB (2R)
* 테스트 환경에서 먼저 검증


RDIMM-3DS: 512GB (2S8Rx4)
---
|-
|Max. DIMM Frequency
|3200MHz
|4800 MHz
|-
|Voltage
|1.2V
|1.1V
|-
| rowspan="2" |I/O
|'''[http://192.168.1.204/index.php/PCIe PCIe] Expansion Slots (SLOT7 close to CPU)'''
|7 PCIe4.0 x16,  2 OCuLink (PCIe4.0 x4), Supports 2 M.2 (PCIe4.0 x4 or SATA 6Gb/s)
|4 PCIe5.0 / CXL1.1 x16*, 3 PCIe5.0 x16, 1 PCIe5.0 x8**
|-
|[[PCIe]] Slots
|SLOT7: PCIe4.0 x16<br/>SLOT6: PCIe4.0 x16<br/>SLOT5: PCIe4.0 x16<br/>SLOT4: PCIe4.0 x16<br/>SLOT3: PCIe4.0 x16<br/>SLOT2: PCIe4.0 x16 or PCIe4.0 x8 + 1 M.2+1 miniSASHD or no PCIe SLOT +2 OCuLink+1 M.2+1 miniSAS HD (by jumper)<br/>SLOT1: PCIe4.0 x16
|SLOT6: PCIe5.0 / CXL1.1 x16
SLOT5: PCIe5.0 x16


SLOT4: PCIe5.0 / CXL1.1 x16
== References ==


SLOT3: PCIe5.0 x16
* [https://wiki.hpcmate.com HMDLS-CUBE]


SLOT2: PCIe5.0 / CXL1.1 x16
---


SLOT1*: PCIe5.0 x16
== Related Pages ==


SLOT0: PCIe5.0 / CXL1.1 x16
* [[Linux]]
 
* [[Server]]
<small><nowiki>*</nowiki>SLOT1 shared lanes with 1 MCIO and 1 M.2. SLOT1 auto-switch to PCIe5.0 x8 when either 1 MCIO or 1 M.2 populated.</small>
* [[Hardware]]
 
* [[Network]]
<small>SLOT7**: PCIe5.0 x8</small>
 
<small><nowiki>**</nowiki>SLOT7 share lanes with 2 MCIO. When SLOT7 occupied, 1 MCIO will not function and 1 MCIO can be enabled by jumper setting. When selecting 1 MCIO, SLOT7 will switch to PCIex4.</small>
|-
| rowspan="8" |Rear IO
|GbE Controller
|Broadcom BCM57416
|Broadcom BCM57416
|-
|RJ45
| colspan="2" |2 RJ45 (10GbE)
1 dedicated IPMI
|-
|BMC Controller
|ASPEED AST2500
|ASPEED AST2600
|-
|IPMI Dedicated GLAN
|1 x Realtek RTL8211E for dedicated management GLAN
|1 Realtek RTL8211F for dedicated management GLAN
|-
|VRAM
| colspan="2" |DDR4 512MB
|-
|VGA Port
| colspan="2" |1 DB15 (VGA)
|-
|Serial Port
|1 DB9 (COM)
|NA
|-
|USB 3.2 Gen1 Port
| colspan="2" |2 Type-A (USB3.2 Gen1)
|-
| rowspan="2" |BIOS
|BIOS Type
|32MB AMI UEFI Legal BIOS
|AMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM
|-
|BIOS Features
|Plug and Play (PnP), ACPI 6.3 Compliance Wake Up Events, SMBIOS 3.3.0, ASRock Rack Instant Flash
|ACPI 6.4 and abouve compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP)
|-
| rowspan="2" |'''Environment'''
|Temperature
| colspan="2" |Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
|-
|Humidity
| colspan="2" |Non operation humidity: 20% ~ 90% ( Non condensing)
|}


== Detailed Configuration ==
---
<pdf>File:DLS_CUBE.pdf</pdf>


== Category ==
[[Category:Server]]
[[Category:Products]]
[[Category:Reference]]
[[Category:HMDLS-CUBE]]
[[Category:Workstation]]
[[Category:AMD]]
[[Category:GPGPU]]
[[Category:Liquid Cooling]]

Revision as of 15:18, 16 July 2026

Template:Status

Template:TOC

Overview

HMDLS-CUBE에 대한 기술 문서입니다.

Summary

  • 무엇인가? - HMDLS-CUBE
  • 왜 필요한가? - HPC 및 서버 환경에서 필수 개념
  • 언제 사용하는가? - 서버 구성, 성능 튜닝, 문제 해결 시

---

Purpose

이 문서가 존재하는 이유

  • Goal: HMDLS-CUBE에 대한 기술 정보 제공
  • Scope: HMDLS-CUBE의 개념, 사용법, 설정
  • Non-goals: 다른 주제로의 확장

---

Key Concepts

Concept Description Related
HMDLS-CUBE HPC/서버 환경에서 중요한 기술 개념 Linux, Server

---

Detailed Explanation

HMDLS-CUBE
  • Artificial intelligence
  • Heavy scientific computation
  • High-performance computing
  • Research lab/national lab
  • Astrophysics, business intelligence
  • DLS-CUBE @ homepage
  1. Physics dynamic optimized liquid cooling design
    1. Unlimited CPU and GPU TDP
    2. Fully integrated hardware & software
    3. Active thermal monitoring and cooling control
    4. In-house design/CNC machining
  2. CoolGX liquid cooling technology - High performance GPGPU computing on the office table
  3. Adjustable Max. noise level through CoolGX configuration
  4. Single Socket AMD EPYC™ 7002/7003/9004 (with AMD 3D V-Cache™ Technology*) series processors
  5. 8 DIMM slots , supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
  6. 2 10GbE, Dedicated IPMI RJ45
  7. 1x2.5", 3 x 3.5" internal drivebay, 2 x M.2 Internal Drive
---

Best Practices

  • 최신 버전 사용 권장
  • 공식 문서 참고
  • 테스트 환경에서 먼저 검증

---

References

---

Related Pages

---

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