HMDLS-CUBE: Difference between revisions

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(Created page with "center|frameless|191x191px|HMDLS-CUBE ==Application== *Artificial intelligence *Big data analytics *High-performance computing *Research lab/national lab *Astrophysics, business intelligence ==Features== #Dual chamber, High Air Flow GPGPU workstation #Quite and adjustable Max. noise level #Space optimized workstation with 2000W PSU #Single Socket SP3 (LGA 4094), supports AMD EPYC™ 7002/7003 (with AMD 3D V-Cache™ Technology*) series processors...")
 
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[[File:Hmdls-cube.png|center|frameless|191x191px|HMDLS-CUBE]]
[[File:Hmdls-cube.png|center|frameless|299x299px|HMDLS-CUBE]]
==Application==
==Application==
*Artificial intelligence
*Artificial intelligence
Line 6: Line 6:
*Research lab/national lab
*Research lab/national lab
*Astrophysics, business intelligence
*Astrophysics, business intelligence
==Features==
* [[Coolgx|CoolGX]] technology
#Dual chamber, High Air Flow GPGPU workstation
** Unlimited CPU and GPU TDP
#Quite and adjustable Max. noise level
** Fully integrated hardware & software
#Space optimized workstation with 2000W PSU
** Active thermal monitoring and cooling control
#Single Socket SP3 (LGA 4094), supports AMD EPYC™ 7002/7003 (with AMD 3D V-Cache™ Technology*) series processors
** In-house design/CNC machining
#8 DIMM slots (1DPC), supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
** High performance GPGPU computing on the office table
 
== Features ==
#Physics dynamic optimized [[liquid cooling]] design
#Adjustable Max. noise level through CoolGX configuration
#Single Socket AMD EPYC™ 7002/7003/9004 (with AMD 3D V-Cache™ Technology*) series processors
#8 DIMM slots , supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
#7 PCIe4.0 x16,  2 OCuLink (PCIe4.0 x4), Supports 2 M.2 (PCIe4.0 x4 or SATA 6Gb/s)
#7 PCIe4.0 x16,  2 OCuLink (PCIe4.0 x4), Supports 2 M.2 (PCIe4.0 x4 or SATA 6Gb/s)
#2 RJ45 (10GbE) by Broadcom BCM57416
#2 10GbE, Dedicated IPMI RJ45
#Remote Management (IPMI)
#1x2.5", 3 x 3.5" internal drivebay, 2 x M.2 Internal Drive
#3 x 3.5" Hotswap Drivebay, 4x2.5"/2 x M.2 Internal Drive
==Specifications==
==Specifications==
{| class="wikitable"
{| class="wikitable"
Line 21: Line 26:
| rowspan="3" |'''System'''
| rowspan="3" |'''System'''
|Form Factor
|Form Factor
|Workstation
|Default configuration
|Optional Configuration
|-
|-
|Dimensions
|Dimensions
|457 x 331 x 407mm (WxHxD)
| colspan="2" |394 x 515 x 662 (W x H x D) mm / 35Kg
|-
|-
|[http://192.168.1.204/index.php/Support Support] MB
|[http://192.168.1.204/index.php/Support Support] MB
|HMD8-2T-BCM
|HMD8-2T-BMC
|HMG8-2T-BMC
|-
|-
| rowspan="2" |'''Cooling'''  
| rowspan="2" |'''Cooling'''  
|[http://192.168.1.204/index.php/Liquid_cooling Liquid Cooling]
|[http://192.168.1.204/index.php/Liquid_cooling Liquid Cooling]
|No
| colspan="2" |Yes (Default)
|-
|-
|Air Cooling
|Air Cooling
|Yes (Default)
| colspan="2" |Yes (Option)
5 x PWM 120x120 mm, 1 x PWM 140x140mm, 2 x 50x50
8 x PWM 120x120 mm, 3 x PWM 140x140mm
|-
|-
|'''UCM'''  
|'''UCM'''  
|UCM Readyness
|UCM Readyness
|Optional
| colspan="2" |Optional
|-
|-
| rowspan="2" |'''Front Panel'''
| rowspan="2" |'''Front Panel'''
|Buttons
|Buttons
|Power w/ LED
| colspan="2" |Power w/ LED, Reset
|-
|-
|LEDs
|LEDs
|HDD Activity
| colspan="2" |HDD Activity
|-
|-
| rowspan="3" |'''Storage'''
| rowspan="3" |'''Storage'''
|Rear Side
|Rear Side
| -
| colspan="2" | -
|-
|-
|Internal Side
|Internal Side
|2 M-key (PCIe4.0 x4), 4 x 2.5" SAS/SATA fixed drive bay
| colspan="2" |2 M-key (PCIe4.0 x4), 1 x 2.5" SAS/SATA internal, 3 x 3.5" SATA internal drive bay
|-
|-
|Front
|Front
|3 x 3.5" SAS/SATA Hotswap drive bay
| -
|
|-
|-
| rowspan="3" |'''Power'''
| rowspan="3" |'''Power'''
|Output Watts
|Output Watts
|2000W
|3000W SPC
|4000W SPC
|-
|-
|Efficiency
|Efficiency
|80-PLUS Platinum
| colspan="2" |80-PLUS Platinum
|-
|-
|AC Input
|AC Input
|Low-line: 100-127V, 47-63Hz ; High-line: 200-240V, 47-63Hz
| colspan="2" |Low-line: 100-127V, 47-63Hz ; High-line: 200-240V, 47-63Hz
|-
|-
| rowspan="3" |'''Processor'''
| rowspan="3" |'''Processor'''
|CPU
|CPU
|Supports AMD EPYC™ 7002/7003 (with AMD 3D V-Cache™ Technology*) Series Processors
|Supports AMD EPYC™ 7002/7003 Series Processors
<nowiki>*</nowiki>A [[BIOS]] update is required to [[support]] AMD EPYC™ 7003 series processors with AMD 3D V-Cache™ Technology
<nowiki>*</nowiki>A [[BIOS]] update is required to [[support]] AMD EPYC™ 7003 series processors with AMD 3D V-Cache™ Technology
|Supports AMD EPYC™ 9004 Series Processors
|-
|-
|Socket
|Socket
|Single Socket SP3 (LGA4094)
|Single Socket SP3 (LGA4094)
|Single Socket SP5 (LGA 6096)
|-
|-
|Chipset
|Chipset
|System on Chip
| colspan="2" |System on Chip
|-
|-
| rowspan="5" |'''Memory'''
| rowspan="5" |'''Memory'''
|DIMM Quantity
|DIMM Quantity
|8 DIMM slots (1DPC)
| colspan="2" |8 DIMM slots (1DPC)
|-
|-
|Supported Type
|Supported Type
|Supports DDR4 288-pin RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
| colspan="2" |Supports DDR4 288-pin RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
|-
|-
|Max. Capacity per DIMM
|Max. Capacity per DIMM
|RDIMM: up to 64GB
|RDIMM: up to 64GB
LRDIMM: up to 128GB
LRDIMM: up to 128GB
RDIMM/LRDIMM-3DS: up to 256GB
RDIMM/LRDIMM-3DS: up to 256GB
NVDIMM-N: up to 32GB
NVDIMM-N: up to 32GB
|Supports DDR5 288-pin RDIMM, RDIMM-3DS
RDIMM: 64GB (2R)
RDIMM-3DS: 512GB (2S8Rx4)
|-
|-
|Max. DIMM Frequency
|Max. DIMM Frequency
|RDIMM/ LRDIMM/NVDIMM-N: max. 3200MHz
|3200MHz
|4800 MHz
|-
|-
|Voltage
|Voltage
|1.2V
|1.2V
|1.1V
|-
|-
| rowspan="2" |I/O
| rowspan="2" |I/O
| colspan="2" |'''[http://192.168.1.204/index.php/PCIe PCIe] Expansion Slots (SLOT7 close to CPU)'''
| colspan="3" |'''[http://192.168.1.204/index.php/PCIe PCIe] Expansion Slots (SLOT7 close to CPU)'''
|-
|-
|[[PCIe]] x 16
|[[PCIe]] x 16
|SLOT7: PCIe4.0 x16<br/>SLOT6: PCIe4.0 x16<br/>SLOT5: PCIe4.0 x16<br/>SLOT4: PCIe4.0 x16<br/>SLOT3: PCIe4.0 x16<br/>SLOT2: PCIe4.0 x16 or PCIe4.0 x8 + 1 M.2+1 miniSASHD or no PCIe SLOT +2 OCuLink+1 M.2+1 miniSAS HD (by jumper)<br/>SLOT1: PCIe4.0 x16
|SLOT7: PCIe4.0 x16<br/>SLOT6: PCIe4.0 x16<br/>SLOT5: PCIe4.0 x16<br/>SLOT4: PCIe4.0 x16<br/>SLOT3: PCIe4.0 x16<br/>SLOT2: PCIe4.0 x16 or PCIe4.0 x8 + 1 M.2+1 miniSASHD or no PCIe SLOT +2 OCuLink+1 M.2+1 miniSAS HD (by jumper)<br/>SLOT1: PCIe4.0 x16
|SLOT6: PCIe5.0 / CXL1.1 x16�
SLOT5: PCIe5.0 / CXL1.1 x16
SLOT4: PCIe5.0 / CXL1.1 x16
SLOT3: PCIe5.0 / CXL1.1 x16
|-
|-
| rowspan="9" |Rear IO
| rowspan="8" |Rear IO
|GbE Controller
|GbE Controller
|1 Broadcom BCM57416 2 RJ45 (10GbE)
|1 Broadcom BCM57416 2 RJ45 (10GbE)
|Intel<sup>®</sup> X550-AT2
|-
|-
|RJ45
|RJ45
|2 RJ45 (10GbE)
| colspan="2" |2 RJ45 (10GbE)
1 dedicated IPMI
1 dedicated IPMI
|-
|-
|BMC Controller
|BMC Controller
|ASPEED AST2500
|ASPEED AST2500
|ASPEED AST2600
|-
|-
|IPMI Dedicated GLAN
|IPMI Dedicated GLAN
|1 x Realtek RTL8211E for dedicated management GLAN
|1 x Realtek RTL8211E for dedicated management GLAN
|-
|1 Realtek RTL8211F for dedicated management GLAN
|Controller
|ASPEED AST2500
|-
|-
|VRAM
|VRAM
|DDR4 512MB
| colspan="2" |DDR4 512MB
|-
|-
|VGA Port
|VGA Port
|1 DB15 (VGA)
| colspan="2" |1 DB15 (VGA)
|-
|-
|Serial Port
|Serial Port
|1 DB9 (COM)
|1 DB9 (COM)
|NA
|-
|-
|USB 3.2 Gen1 Port
|USB 3.2 Gen1 Port
|2 Type-A (USB3.2 Gen1)
| colspan="2" |2 Type-A (USB3.2 Gen1)
|-
|-
| rowspan="2" |BIOS
| rowspan="2" |BIOS
|BIOS Type
|BIOS Type
|32MB AMI UEFI Legal BIOS
|32MB AMI UEFI Legal BIOS
|AMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM
|-
|-
|BIOS Features
|BIOS Features
|Plug and Play (PnP), ACPI 6.3 Compliance Wake Up Events, SMBIOS 3.3.0, ASRock Rack Instant Flash
|Plug and Play (PnP), ACPI 6.3 Compliance Wake Up Events, SMBIOS 3.3.0, ASRock Rack Instant Flash
|ACPI 6.4 and abouve compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP)
|-
|-
| rowspan="2" |'''Environment'''
| rowspan="2" |'''Environment'''
|Temperature
|Temperature
|Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
| colspan="2" |Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
|-
|-
|Humidity
|Humidity
|Non operation humidity: 20% ~ 90% ( Non condensing)
| colspan="2" |Non operation humidity: 20% ~ 90% ( Non condensing)
|}
|}


Revision as of 17:04, 12 May 2023

HMDLS-CUBE

Application

  • Artificial intelligence
  • Big data analytics
  • High-performance computing
  • Research lab/national lab
  • Astrophysics, business intelligence
  • CoolGX technology
    • Unlimited CPU and GPU TDP
    • Fully integrated hardware & software
    • Active thermal monitoring and cooling control
    • In-house design/CNC machining
    • High performance GPGPU computing on the office table

Features

  1. Physics dynamic optimized liquid cooling design
  2. Adjustable Max. noise level through CoolGX configuration
  3. Single Socket AMD EPYC™ 7002/7003/9004 (with AMD 3D V-Cache™ Technology*) series processors
  4. 8 DIMM slots , supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
  5. 7 PCIe4.0 x16, 2 OCuLink (PCIe4.0 x4), Supports 2 M.2 (PCIe4.0 x4 or SATA 6Gb/s)
  6. 2 10GbE, Dedicated IPMI RJ45
  7. 1x2.5", 3 x 3.5" internal drivebay, 2 x M.2 Internal Drive

Specifications

System Form Factor Default configuration Optional Configuration
Dimensions 394 x 515 x 662 (W x H x D) mm / 35Kg
Support MB HMD8-2T-BMC HMG8-2T-BMC
Cooling Liquid Cooling Yes (Default)
Air Cooling Yes (Option)

8 x PWM 120x120 mm, 3 x PWM 140x140mm

UCM UCM Readyness Optional
Front Panel Buttons Power w/ LED, Reset
LEDs HDD Activity
Storage Rear Side -
Internal Side 2 M-key (PCIe4.0 x4), 1 x 2.5" SAS/SATA internal, 3 x 3.5" SATA internal drive bay
Front -
Power Output Watts 3000W SPC 4000W SPC
Efficiency 80-PLUS Platinum
AC Input Low-line: 100-127V, 47-63Hz ; High-line: 200-240V, 47-63Hz
Processor CPU Supports AMD EPYC™ 7002/7003 Series Processors

*A BIOS update is required to support AMD EPYC™ 7003 series processors with AMD 3D V-Cache™ Technology

Supports AMD EPYC™ 9004 Series Processors
Socket Single Socket SP3 (LGA4094) Single Socket SP5 (LGA 6096)
Chipset System on Chip
Memory DIMM Quantity 8 DIMM slots (1DPC)
Supported Type Supports DDR4 288-pin RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
Max. Capacity per DIMM RDIMM: up to 64GB

LRDIMM: up to 128GB

RDIMM/LRDIMM-3DS: up to 256GB

NVDIMM-N: up to 32GB

Supports DDR5 288-pin RDIMM, RDIMM-3DS

RDIMM: 64GB (2R)

RDIMM-3DS: 512GB (2S8Rx4)

Max. DIMM Frequency 3200MHz 4800 MHz
Voltage 1.2V 1.1V
I/O PCIe Expansion Slots (SLOT7 close to CPU)
PCIe x 16 SLOT7: PCIe4.0 x16
SLOT6: PCIe4.0 x16
SLOT5: PCIe4.0 x16
SLOT4: PCIe4.0 x16
SLOT3: PCIe4.0 x16
SLOT2: PCIe4.0 x16 or PCIe4.0 x8 + 1 M.2+1 miniSASHD or no PCIe SLOT +2 OCuLink+1 M.2+1 miniSAS HD (by jumper)
SLOT1: PCIe4.0 x16 		SLOT6: PCIe5.0 / CXL1.1 x16�

SLOT5: PCIe5.0 / CXL1.1 x16

SLOT4: PCIe5.0 / CXL1.1 x16

SLOT3: PCIe5.0 / CXL1.1 x16

Rear IO GbE Controller 1 Broadcom BCM57416 2 RJ45 (10GbE) Intel® X550-AT2
RJ45 2 RJ45 (10GbE)

1 dedicated IPMI

BMC Controller ASPEED AST2500 ASPEED AST2600
IPMI Dedicated GLAN 1 x Realtek RTL8211E for dedicated management GLAN 1 Realtek RTL8211F for dedicated management GLAN
VRAM DDR4 512MB
VGA Port 1 DB15 (VGA)
Serial Port 1 DB9 (COM) NA
USB 3.2 Gen1 Port 2 Type-A (USB3.2 Gen1)
BIOS BIOS Type 32MB AMI UEFI Legal BIOS AMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM
BIOS Features Plug and Play (PnP), ACPI 6.3 Compliance Wake Up Events, SMBIOS 3.3.0, ASRock Rack Instant Flash ACPI 6.4 and abouve compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP)
Environment Temperature Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
Humidity Non operation humidity: 20% ~ 90% ( Non condensing)
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