HMDLS-CUBE
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Application
- Artificial intelligence
- Big data analytics
- High-performance computing
- Research lab/national lab
- Astrophysics, business intelligence
- CoolGX technology
- Unlimited CPU and GPU TDP
- Fully integrated hardware & software
- Active thermal monitoring and cooling control
- In-house design/CNC machining
- High performance GPGPU computing on the office table
Features
- Physics dynamic optimized liquid cooling design
- Adjustable Max. noise level through CoolGX configuration
- Single Socket AMD EPYC™ 7002/7003/9004 (with AMD 3D V-Cache™ Technology*) series processors
- 8 DIMM slots , supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
- 2 10GbE, Dedicated IPMI RJ45
- 1x2.5", 3 x 3.5" internal drivebay, 2 x M.2 Internal Drive
Specifications
| System | Form Factor | Default configuration | Optional Configuration |
| Dimensions | 394 x 515 x 662 (W x H x D) mm / 35Kg | ||
| Support MB | HMD8-2T-BMC | HMG8-2T-BMC | |
| Cooling | Liquid Cooling | Yes (Default) | |
| Air Cooling | Yes (Option)
8 x PWM 120x120 mm, 3 x PWM 140x140mm | ||
| UCM | UCM Readyness | Optional | |
| Front Panel | Buttons | Power w/ LED, Reset | |
| LEDs | HDD Activity | ||
| Storage | Rear Side | - | |
| Internal Side | 2 M-key (PCIe4.0 x4), 1 x 2.5" SAS/SATA internal, 3 x 3.5" SATA internal drive bay | ||
| Front | - | ||
| Power | Output Watts | 3000W SPC | 4000W SPC |
| Efficiency | 80-PLUS Platinum | ||
| AC Input | Low-line: 100-127V, 47-63Hz ; High-line: 200-240V, 47-63Hz | ||
| Processor | CPU | Supports AMD EPYC™ 7002/7003 Series Processors
*A BIOS update is required to support AMD EPYC™ 7003 series processors with AMD 3D V-Cache™ Technology |
Supports AMD EPYC™ 9004 Series Processors |
| Socket | Single Socket SP3 (LGA4094) | Single Socket SP5 (LGA 6096) | |
| Chipset | System on Chip | ||
| Memory | DIMM Quantity | 8 DIMM slots (1DPC) | |
| Supported Type | Supports DDR4 288-pin RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N | ||
| Max. Capacity per DIMM | RDIMM: up to 64GB
LRDIMM: up to 128GB RDIMM/LRDIMM-3DS: up to 256GB NVDIMM-N: up to 32GB |
Supports DDR5 288-pin RDIMM, RDIMM-3DS
RDIMM: 64GB (2R) RDIMM-3DS: 512GB (2S8Rx4) | |
| Max. DIMM Frequency | 3200MHz | 4800 MHz | |
| Voltage | 1.2V | 1.1V | |
| I/O | PCIe Expansion Slots (SLOT7 close to CPU) | 7 PCIe4.0 x16, 2 OCuLink (PCIe4.0 x4), Supports 2 M.2 (PCIe4.0 x4 or SATA 6Gb/s) | 4 PCIe5.0 / CXL1.1 x16 |
| PCIe x 16 | SLOT7: PCIe4.0 x16 SLOT6: PCIe4.0 x16 SLOT5: PCIe4.0 x16 SLOT4: PCIe4.0 x16 SLOT3: PCIe4.0 x16 SLOT2: PCIe4.0 x16 or PCIe4.0 x8 + 1 M.2+1 miniSASHD or no PCIe SLOT +2 OCuLink+1 M.2+1 miniSAS HD (by jumper) SLOT1: PCIe4.0 x16 |
4 PCIe5.0 / CXL1.1 x16
SLOT6: PCIe5.0 / CXL1.1 x16 SLOT5: PCIe5.0 / CXL1.1 x16 SLOT4: PCIe5.0 / CXL1.1 x16 SLOT3: PCIe5.0 / CXL1.1 x16 | |
| Rear IO | GbE Controller | 1 Broadcom BCM57416 2 RJ45 (10GbE) | Intel® X550-AT2 |
| RJ45 | 2 RJ45 (10GbE)
1 dedicated IPMI | ||
| BMC Controller | ASPEED AST2500 | ASPEED AST2600 | |
| IPMI Dedicated GLAN | 1 x Realtek RTL8211E for dedicated management GLAN | 1 Realtek RTL8211F for dedicated management GLAN | |
| VRAM | DDR4 512MB | ||
| VGA Port | 1 DB15 (VGA) | ||
| Serial Port | 1 DB9 (COM) | NA | |
| USB 3.2 Gen1 Port | 2 Type-A (USB3.2 Gen1) | ||
| BIOS | BIOS Type | 32MB AMI UEFI Legal BIOS | AMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM |
| BIOS Features | Plug and Play (PnP), ACPI 6.3 Compliance Wake Up Events, SMBIOS 3.3.0, ASRock Rack Instant Flash | ACPI 6.4 and abouve compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP) | |
| Environment | Temperature | Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C | |
| Humidity | Non operation humidity: 20% ~ 90% ( Non condensing) | ||