HMDLS-CUBE

Application

• Artificial intelligence
• Heavy scientific computation
• High-performance computing
• Research lab/national lab
• Astrophysics, business intelligence
• DLS-CUBE @ homepage

Features

1. Physics dynamic optimized liquid cooling design
   1. Unlimited CPU and GPU TDP
   2. Fully integrated hardware & software
   3. Active thermal monitoring and cooling control
   4. In-house design/CNC machining
2. CoolGX liquid cooling technology - High performance GPGPU computing on the office table
3. Adjustable Max. noise level through CoolGX configuration
4. Single Socket AMD EPYC™ 7002/7003/9004 (with AMD 3D V-Cache™ Technology*) series processors
5. 8 DIMM slots , supports DDR4 RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
6. 2 10GbE, Dedicated IPMI RJ45
7. 1x2.5", 3 x 3.5" internal drivebay, 2 x M.2 Internal Drive

Specifications

System	Model	Default configuration	Optional Configuration
	Dimensions	394 x 515 x 662 (W x H x D) mm / 35Kg
	Support MB	HMD8-2T-BMC	HMGD8-2T-BMC
Cooling	Liquid Cooling	Yes (Default)
	Air Cooling	Yes (Option) 8 x PWM 120x120 mm, 3 x PWM 140x140mm *Air cooling limites: Max. 4 GPUs, up to 300W TDP CPU
UCM	UCM Readyness	Optional
Front Panel	Buttons	Power w/ LED, Reset
	LEDs	HDD Activity
Storage	Rear Side	-
	Internal Side	2 M-key (PCIe4.0 x4), 1 x 2.5" SAS/SATA internal, 3 x 3.5" SATA internal drive bay
	Front	-
Power	Output Watts	3000W SPC	4000W SPC
	Efficiency	80-PLUS Platinum
	AC Input	Low-line: 100-127V, 47-63Hz ; High-line: 200-240V, 47-63Hz
Processor	CPU	Supports AMD EPYC™ 7002/7003 Series Processors *A BIOS update is required to support AMD EPYC™ 7003 series processors with AMD 3D V-Cache™ Technology	Supports AMD EPYC™ 9004 Series Processors
	Socket	Single Socket SP3 (LGA4094)	Single Socket SP5 (LGA 6096)
	Chipset	System on Chip
Memory	DIMM Quantity	8 DIMM slots (1DPC)
	Supported Type	Supports DDR4 288-pin RDIMM, LRDIMM, RDIMM/LRDIMM-3DS, NVDIMM-N
	Max. Capacity per DIMM	RDIMM: up to 64GB LRDIMM: up to 128GB RDIMM/LRDIMM-3DS: up to 256GB NVDIMM-N: up to 32GB	Supports DDR5 288-pin RDIMM, RDIMM-3DS RDIMM: 64GB (2R) RDIMM-3DS: 512GB (2S8Rx4)
	Max. DIMM Frequency	3200MHz	4800 MHz
	Voltage	1.2V	1.1V
I/O	PCIe Expansion Slots (SLOT7 close to CPU)	7 PCIe4.0 x16, 2 OCuLink (PCIe4.0 x4), Supports 2 M.2 (PCIe4.0 x4 or SATA 6Gb/s)	4 PCIe5.0 / CXL1.1 x16*, 3 PCIe5.0 x16, 1 PCIe5.0 x8**
	PCIe Slots	SLOT7: PCIe4.0 x16 SLOT6: PCIe4.0 x16 SLOT5: PCIe4.0 x16 SLOT4: PCIe4.0 x16 SLOT3: PCIe4.0 x16 SLOT2: PCIe4.0 x16 or PCIe4.0 x8 + 1 M.2+1 miniSASHD or no PCIe SLOT +2 OCuLink+1 M.2+1 miniSAS HD (by jumper) SLOT1: PCIe4.0 x16	SLOT6: PCIe5.0 / CXL1.1 x16 SLOT5: PCIe5.0 x16 SLOT4: PCIe5.0 / CXL1.1 x16 SLOT3: PCIe5.0 x16 SLOT2: PCIe5.0 / CXL1.1 x16 SLOT1*: PCIe5.0 x16 SLOT0: PCIe5.0 / CXL1.1 x16 *SLOT1 shared lanes with 1 MCIO and 1 M.2. SLOT1 auto-switch to PCIe5.0 x8 when either 1 MCIO or 1 M.2 populated. SLOT7**: PCIe5.0 x8 **SLOT7 share lanes with 2 MCIO. When SLOT7 occupied, 1 MCIO will not function and 1 MCIO can be enabled by jumper setting. When selecting 1 MCIO, SLOT7 will switch to PCIex4.
Rear IO	GbE Controller	Broadcom BCM57416	Broadcom BCM57416
	RJ45	2 RJ45 (10GbE) 1 dedicated IPMI
	BMC Controller	ASPEED AST2500	ASPEED AST2600
	IPMI Dedicated GLAN	1 x Realtek RTL8211E for dedicated management GLAN	1 Realtek RTL8211F for dedicated management GLAN
	VRAM	DDR4 512MB
	VGA Port	1 DB15 (VGA)
	Serial Port	1 DB9 (COM)	NA
	USB 3.2 Gen1 Port	2 Type-A (USB3.2 Gen1)
BIOS	BIOS Type	32MB AMI UEFI Legal BIOS	AMI UEFI BIOS; 256 Mb (32MB) SPI Flash ROM
	BIOS Features	Plug and Play (PnP), ACPI 6.3 Compliance Wake Up Events, SMBIOS 3.3.0, ASRock Rack Instant Flash	ACPI 6.4 and abouve compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP)
Environment	Temperature	Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C
	Humidity	Non operation humidity: 20% ~ 90% ( Non condensing)