HMG493-SB1: Difference between revisions
|  (Created page with "center|frameless|726x726px|HMG493-SB1  ==Application[edit | edit source]== *Artificial intelligence *Heavy scientific computation *High-performance computing *Research lab/national lab *Astrophysics, business intelligence ==Features[edit | edit source]== #2 Intel Gen 4<sup>th</sup> Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage # 4U formfactor, 10 double-width full-height GPUs over PCIe 5.0, Dual ROM Architecture # Dual processor, LGA...") | |||
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| [[File:HMG493-SB1.png|center|frameless|726x726px|HMG493-SB1]] | [[File:HMG493-SB1.png|center|frameless|726x726px|HMG493-SB1]] | ||
| ==Application | ==Application== | ||
| *Artificial intelligence | *Artificial intelligence | ||
| *Heavy scientific computation | *Heavy scientific computation | ||
| Line 7: | Line 7: | ||
| *Research lab/national lab | *Research lab/national lab | ||
| *Astrophysics, business intelligence | *Astrophysics, business intelligence | ||
| ==Features | ==Features== | ||
| #2 Intel Gen 4<sup>th</sup> Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage | #2 x Intel Gen 4<sup>th</sup> or 5<sup>th</sup> Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage | ||
| # 4U formfactor, 10 double-width full-height GPUs over [[PCIe]] 5.0, Dual ROM Architecture | # 4U formfactor, 10 double-width full-height GPUs over [[PCIe]] 5.0, Dual ROM Architecture | ||
| # Dual processor, LGA 4677, Intel<sup>®</sup> 4th Gen Xeon<sup>®</sup> Scalable and Intel<sup>®</sup> Xeon<sup>®</sup> CPU Max Series Processors (CPU TDP up to 350W) | # Dual processor, LGA 4677, Intel<sup>®</sup> 4th Gen Xeon<sup>®</sup> Scalable and Intel<sup>®</sup> Xeon<sup>®</sup> CPU Max Series Processors (CPU TDP up to 350W) | ||
| Line 17: | Line 17: | ||
| # 3+1 3000W 80 PLUS Titanium redundant power | # 3+1 3000W 80 PLUS Titanium redundant power | ||
| # Suitable for various application scenarios, including big data analysis, 3D graphics applications, video decoding, deep learning, scientific computing, and more | # Suitable for various application scenarios, including big data analysis, 3D graphics applications, video decoding, deep learning, scientific computing, and more | ||
| ==Specifications | ==Specifications== | ||
| {| class="wikitable" | {| class="wikitable" | ||
| |'''Type''' | |'''Type''' | ||
| |'''Description''' | |||
| |- | |- | ||
| |'''Processor''' | |'''Processor''' | ||
| |4th  | |4th Gen Intel<sup>®</sup> Xeon<sup>®</sup> Scalable Processors, | ||
| 5th Gen Intel<sup>®</sup> Xeon<sup>®</sup> Scalable Processors  | |||
| , Intel<sup>®</sup> Xeon<sup>®</sup> CPU Max Series,   | |||
| Dual processor, CPU TDP up to 350W | |||
| '''Optional [[liquid cooling]] with [[CoolUX]] that support unlimited CPU TDP''' | |||
| |- | |- | ||
| |'''Memory''' | |'''Memory''' | ||
| |32 x DIMM slots | |||
| DDR5 memory supported only | DDR5 memory supported only | ||
| Line 39: | Line 43: | ||
| |- | |- | ||
| |'''Storage''' | |'''Storage''' | ||
| |SATA RAID 0/1/10/5 | |||
| |- | |- | ||
| |Drive Bays | |Drive Bays | ||
| |12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS*hot-swappable bays (optional '''SAS card for SAS devices)''' | |||
| 1 x M.2 slot with PCIe Gen3 x1 interface onboard | 1 x M.2 slot with PCIe Gen3 x1 interface onboard | ||
| |- | |- | ||
| | rowspan="2" |Cooling | | rowspan="2" |Cooling | ||
| |Air cooling | |Air cooling   | ||
| 4 x 40x40x28mm (25,000rpm) | |||
| 12 x 60x60x38mm (23,000rpm) | |||
| |- | |- | ||
| | | |'''Optional liquid cooling with [[CoolUX]]  : No screaming Fan noise Max. < 50dbA''' | ||
| |- | |- | ||
| |'''Expansion Slots''' | |'''Expansion Slots''' | ||
| |10 x FHFL PCIe Gen5 x16 slots for double-width GPUs   | |10 x FHFL PCIe Gen5 x16 slots for double-width GPUs   | ||
| 2 x LP PCIe Gen5 x16 slots on front side   | 2 x LP PCIe Gen5 x16 slots on front side ( '''Optional liquid cooling with [[CoolUX]]  uses this area for coolant in/out''' )  | ||
| |- | |- | ||
| |'''Network''' | |'''Network''' | ||
| |2 x 10Gb/s BASE-T LAN ports (NCSI function supported) | |2 x 10Gb/s BASE-T LAN ports (NCSI function supported) | ||
| 1 x 10/100/1000 IBMI management LAN (Dual ROM architecture – remove firmware update, management and monitoring) | 1 x 10/100/1000 IBMI management LAN (Dual ROM architecture – remove firmware update, management and monitoring) | ||
| |- | |- | ||
| |Chipset | |Chipset | ||
| |Intel<sup>®</sup> C741 Chipset | |Intel<sup>®</sup> C741 Chipset | ||
| |- | |- | ||
| |'''Switch/LED''' | |'''Switch/LED''' | ||
| |'''Front :''' | |||
| 2 x USB 3.2 Gen1 | 2 x USB 3.2 Gen1 | ||
| Line 90: | Line 91: | ||
| |'''Rear I/O Ports''' | |'''Rear I/O Ports''' | ||
| |N/A | |N/A | ||
| |- | |- | ||
| |'''OS [[Support]]''' | |'''OS [[Support]]''' | ||
| |[[Linux]] Ubuntu 20.04 LTS with kernel level [[optimization]] | |||
| |- | |- | ||
| |'''Software''' | |'''Software''' | ||
| |HPCMATE DLS Framework | |||
| |- | |- | ||
| |'''Power Supply''' | |'''Power Supply''' | ||
| |3+1 3000W (240V) 80 PLUS Titanium redundant power supplies | |||
| |- | |- | ||
| |'''Dimension/Net Weight''' | |'''Dimension/Net Weight''' | ||
| |448 x 176 x 880(WxHxD, mm) | |||
| 1200 x 800 x 444 mm w/ pallet | 1200 x 800 x 444 mm w/ pallet | ||
| |- | |- | ||
| |'''Environment''' | |'''Environment''' | ||
| |Operating temperature: 10°C to 35°C | |||
| Operating humidity: 8%-80% (non-condensing) | Operating humidity: 8%-80% (non-condensing) | ||
Latest revision as of 12:48, 12 January 2024
Application
- Artificial intelligence
- Heavy scientific computation
- High-performance computing
- Research lab/national lab
- Astrophysics, business intelligence
Features
- 2 x Intel Gen 4th or 5th Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage
- 4U formfactor, 10 double-width full-height GPUs over PCIe 5.0, Dual ROM Architecture
- Dual processor, LGA 4677, Intel® 4th Gen Xeon® Scalable and Intel® Xeon® CPU Max Series Processors (CPU TDP up to 350W)
- 32 x DIMMs slots, 8-Channel RDIMM DDR5
- 2 x 10Gb/s BASE-T LAN ports and 1 x Dedicated management port
- 1 x M.2 slot with PCIe Gen3 x1 interface / 12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS* hot-swap bays
- 10 x FHFL PCIe Gen5 x16 slots for double-width GPUs / 2 x LP PCIe Gen5 x16 slots on front side
- 3+1 3000W 80 PLUS Titanium redundant power
- Suitable for various application scenarios, including big data analysis, 3D graphics applications, video decoding, deep learning, scientific computing, and more
Specifications
| Type | Description | 
| Processor | 4th Gen Intel® Xeon® Scalable Processors, 5th Gen Intel® Xeon® Scalable Processors , Intel® Xeon® CPU Max Series, Dual processor, CPU TDP up to 350W Optional liquid cooling with CoolUX that support unlimited CPU TDP | 
| Memory | 32 x DIMM slots DDR5 memory supported only 8-Channel memory architecture per processor RDIMM modules up to 96GB supported 3DS RDIMM modules up to 256GB supported Memory speed: Up to 4800 MHz (1DPC), 4400 MHz (2DPC) | 
| Storage | SATA RAID 0/1/10/5 | 
| Drive Bays | 12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS*hot-swappable bays (optional SAS card for SAS devices) 1 x M.2 slot with PCIe Gen3 x1 interface onboard | 
| Cooling | Air cooling 4 x 40x40x28mm (25,000rpm) 12 x 60x60x38mm (23,000rpm) | 
| Optional liquid cooling with CoolUX : No screaming Fan noise Max. < 50dbA | |
| Expansion Slots | 10 x FHFL PCIe Gen5 x16 slots for double-width GPUs 2 x LP PCIe Gen5 x16 slots on front side ( Optional liquid cooling with CoolUX uses this area for coolant in/out ) | 
| Network | 2 x 10Gb/s BASE-T LAN ports (NCSI function supported) 1 x 10/100/1000 IBMI management LAN (Dual ROM architecture – remove firmware update, management and monitoring) | 
| Chipset | Intel® C741 Chipset | 
| Switch/LED | Front : 2 x USB 3.2 Gen1 1 x VGA 2 x RJ45 1 x MLAN 1 x Power button with LED 1 x ID button with LED 1 x Reset button 1 x NMI button 1 x System status LED 1 x HDD access LED | 
| Rear I/O Ports | N/A | 
| OS Support | Linux Ubuntu 20.04 LTS with kernel level optimization | 
| Software | HPCMATE DLS Framework | 
| Power Supply | 3+1 3000W (240V) 80 PLUS Titanium redundant power supplies | 
| Dimension/Net Weight | 448 x 176 x 880(WxHxD, mm) 1200 x 800 x 444 mm w/ pallet | 
| Environment | Operating temperature: 10°C to 35°C Operating humidity: 8%-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) | 
