HMG493-SB1: Difference between revisions
Line 1: | Line 1: | ||
[[File:HMG493-SB1.png|center|frameless|726x726px|HMG493-SB1]] | [[File:HMG493-SB1.png|center|frameless|726x726px|HMG493-SB1]] | ||
==Application | ==Application== | ||
*Artificial intelligence | *Artificial intelligence | ||
*Heavy scientific computation | *Heavy scientific computation | ||
Line 7: | Line 7: | ||
*Research lab/national lab | *Research lab/national lab | ||
*Astrophysics, business intelligence | *Astrophysics, business intelligence | ||
==Features | ==Features== | ||
#2 Intel Gen 4<sup>th</sup> Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage | #2 x Intel Gen 4<sup>th</sup> Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage | ||
# 4U formfactor, 10 double-width full-height GPUs over [[PCIe]] 5.0, Dual ROM Architecture | # 4U formfactor, 10 double-width full-height GPUs over [[PCIe]] 5.0, Dual ROM Architecture | ||
# Dual processor, LGA 4677, Intel<sup>®</sup> 4th Gen Xeon<sup>®</sup> Scalable and Intel<sup>®</sup> Xeon<sup>®</sup> CPU Max Series Processors (CPU TDP up to 350W) | # Dual processor, LGA 4677, Intel<sup>®</sup> 4th Gen Xeon<sup>®</sup> Scalable and Intel<sup>®</sup> Xeon<sup>®</sup> CPU Max Series Processors (CPU TDP up to 350W) | ||
Line 17: | Line 17: | ||
# 3+1 3000W 80 PLUS Titanium redundant power | # 3+1 3000W 80 PLUS Titanium redundant power | ||
# Suitable for various application scenarios, including big data analysis, 3D graphics applications, video decoding, deep learning, scientific computing, and more | # Suitable for various application scenarios, including big data analysis, 3D graphics applications, video decoding, deep learning, scientific computing, and more | ||
==Specifications | ==Specifications== | ||
{| class="wikitable" | {| class="wikitable" | ||
|'''Type''' | |'''Type''' |
Revision as of 15:59, 17 December 2023
Application
- Artificial intelligence
- Heavy scientific computation
- High-performance computing
- Research lab/national lab
- Astrophysics, business intelligence
Features
- 2 x Intel Gen 4th Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage
- 4U formfactor, 10 double-width full-height GPUs over PCIe 5.0, Dual ROM Architecture
- Dual processor, LGA 4677, Intel® 4th Gen Xeon® Scalable and Intel® Xeon® CPU Max Series Processors (CPU TDP up to 350W)
- 32 x DIMMs slots, 8-Channel RDIMM DDR5
- 2 x 10Gb/s BASE-T LAN ports and 1 x Dedicated management port
- 1 x M.2 slot with PCIe Gen3 x1 interface / 12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS* hot-swap bays
- 10 x FHFL PCIe Gen5 x16 slots for double-width GPUs / 2 x LP PCIe Gen5 x16 slots on front side
- 3+1 3000W 80 PLUS Titanium redundant power
- Suitable for various application scenarios, including big data analysis, 3D graphics applications, video decoding, deep learning, scientific computing, and more
Specifications
Type | Description |
Processor | 4th Generation Intel® Xeon® Scalable Processors, Intel® Xeon® CPU Max Series, Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor, Dual processor, CPU TDP up to 350W
Optional liquid cooling with CoolUX that support unlimited CPU TDP |
Memory | 32 x DIMM slots
DDR5 memory supported only 8-Channel memory architecture per processor RDIMM modules up to 96GB supported 3DS RDIMM modules up to 256GB supported Memory speed: Up to 4800 MHz (1DPC), 4400 MHz (2DPC) |
Storage | SATA RAID 0/1/10/5 |
Drive Bays | 12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS*hot-swappable bays (optional SAS card for SAS devices)
1 x M.2 slot with PCIe Gen3 x1 interface onboard |
Cooling | Air cooling
4 x 40x40x28mm (25,000rpm) 12 x 60x60x38mm (23,000rpm) |
Optional liquid cooling with CoolUX : No screaming Fan noise Max. < 50dbA | |
Expansion Slots | 10 x FHFL PCIe Gen5 x16 slots for double-width GPUs
2 x LP PCIe Gen5 x16 slots on front side ( Optional liquid cooling with CoolUX uses this area for coolant in/out ) |
Network | 2 x 10Gb/s BASE-T LAN ports (NCSI function supported)
1 x 10/100/1000 IBMI management LAN (Dual ROM architecture – remove firmware update, management and monitoring) |
Chipset | Intel® C741 Chipset |
Switch/LED | Front :
2 x USB 3.2 Gen1 1 x VGA 2 x RJ45 1 x MLAN 1 x Power button with LED 1 x ID button with LED 1 x Reset button 1 x NMI button 1 x System status LED 1 x HDD access LED |
Rear I/O Ports | N/A |
OS Support | Linux Ubuntu 20.04 LTS |
Software | HPCMATE DLS Framework |
Power Supply | 3+1 3000W (240V) 80 PLUS Titanium redundant power supplies |
Dimension/Net Weight | 448 x 176 x 880(WxHxD, mm)
1200 x 800 x 444 mm w/ pallet |
Environment | Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing) |