HMG493-SB1

Application[edit | edit source]

• Artificial intelligence
• Heavy scientific computation
• High-performance computing
• Research lab/national lab
• Astrophysics, business intelligence

Features[edit | edit source]

1. 2 Intel Gen 4^th Sockets, 10-GPUs, 4U Accelerator Server for HPC and Storage
2. 4U formfactor, 10 double-width full-height GPUs over PCIe 5.0, Dual ROM Architecture
3. Dual processor, LGA 4677, Intel^® 4th Gen Xeon^® Scalable and Intel^® Xeon^® CPU Max Series Processors (CPU TDP up to 350W)
4. 32 x DIMMs slots, 8-Channel RDIMM DDR5
5. 2 x 10Gb/s BASE-T LAN ports and 1 x Dedicated management port
6. 1 x M.2 slot with PCIe Gen3 x1 interface / 12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS* hot-swap bays
7. 10 x FHFL PCIe Gen5 x16 slots for double-width GPUs / 2 x LP PCIe Gen5 x16 slots on front side
8. 3+1 3000W 80 PLUS Titanium redundant power
9. Suitable for various application scenarios, including big data analysis, 3D graphics applications, video decoding, deep learning, scientific computing, and more

Specifications[edit | edit source]

Type	Description
Processor	4th Generation Intel® Xeon® Scalable Processors, Intel® Xeon® CPU Max Series, Intel® Xeon® Platinum Processor, Intel® Xeon® Gold Processor, Intel® Xeon® Silver Processor, Dual processor, CPU TDP up to 350W	Same except unlimited TDP with CoolUX
Memory	32 x DIMM slots DDR5 memory supported only 8-Channel memory architecture per processor RDIMM modules up to 96GB supported 3DS RDIMM modules up to 256GB supported Memory speed: Up to 4800 MHz (1DPC), 4400 MHz (2DPC)
Storage	SATA RAID 0/1/10/5
Drive Bays	12 x 3.5"/2.5" Gen5 NVMe/SATA/SAS*hot-swappable bays (optional SAS card for SAS devices) 1 x M.2 slot with PCIe Gen3 x1 interface onboard
Cooling	Air cooling	Liquid cooling
	6 x 60x60x38mm (23,000rpm)	Yes, CoolUX
Expansion Slots	10 x FHFL PCIe Gen5 x16 slots for double-width GPUs 2 x LP PCIe Gen5 x16 slots on front side
Network	2 x 10Gb/s BASE-T LAN ports (NCSI function supported) 1 x 10/100/1000 IBMI management LAN (Dual ROM architecture – remove firmware update, management and monitoring)
Chipset	Intel® C741 Chipset
Switch/LED	Front : 2 x USB 3.2 Gen1 1 x VGA 2 x RJ45 1 x MLAN 1 x Power button with LED 1 x ID button with LED 1 x Reset button 1 x NMI button 1 x System status LED 1 x HDD access LED
Rear I/O Ports	N/A	Coolant In and Out
OS Support	Linux Ubuntu 20.04 LTS
Software	HPCMATE DLS Framework
Power Supply	3+1 3000W (240V) 80 PLUS Titanium redundant power supplies
Dimension/Net Weight	448 x 176 x 880(WxHxD, mm) 1200 x 800 x 444 mm w/ pallet
Environment	Operating temperature: 10°C to 35°C Operating humidity: 8%-80% (non-condensing) Non-operating temperature: -40°C to 60°C Non-operating humidity: 20%-95% (non-condensing)